Das Jobportal für Wissenschaft, Forschung und Management Aktuelle Stellenangebote aus Universitäten, Hochschulen, Forschungsinstituten und Wissenschaftsorganisationen

25 km

Informationen zur Anzeige:

Process Development Engineer (d/m/f) Chip Singulation
Aktualität: 06.06.2023


06.06.2023, OSRAM GmbH
Process Development Engineer (d/m/f) Chip Singulation
Process development and optimization in the field of chip singulation by laser dicing, laser grooving or wafer sawing and associated support processes (e.g., tape processes, application of protection coatings) Development and transfer of cost-efficient, fully automated, and robust processes for large-scale production Process improvements on existing production tools, including the evaluation and introduction of new processes, materials, and equipment - also in cooperation with equipment manufacturers Participation in cross-functional project and problem-solving teams Qualification and characterization of the materials and process media
Successfully completed master study of engineering (e.g., microsystems technology), material science or physics, PhD an advantage Professional experience in an industrial environment, such as the semiconductor industry, advantageous Strong physical and chemical understanding of semiconductor processes (wafer processing) and knowledge of relevant analytical methods Knowledge in one or more of the following processes advantageous: wafer sawing, laser dicing, laser grooving, tape processes, coating technology or other mechanical wafer processes Experience in tool procurement (evaluation, creation of specifications) Excellent communication and team skills, analytical thinking, and creativity, as well as a structured way of working Good knowledge of German and English Occasional willingness to travel




Process Development Engineer (d­­/­­m­­/­­f) Chip Singulation